The Energy and Mass of Ag/C and Cu in Protection devices
The Ag/C step contact material shows the maximum electron energy less than the Cu Punch contact material. However, there is only one
chemical element, O II appears in both Ag/C step and Cu Punch contact material.
Both contact Material Ag/C step and Cu punch have the same lowest energy at the
wavelength 821 nm for chemical elements N I, O I and O II.
The Mass of the chemical elements Ag I and Cu II is higher than other chemical
elements about 4 times in the Ag/C step contact material. The maximum Mass when using the Cu Punch contact material is the chemical element Cu II
at the wavelength 776 nm. This confirms that the chemical
element Ag I and Cu II come from the contact material. Both the Ag/C step
contact material and Cu Punch contact material show the
minimum Mass is the chemical element H. The average Mass of
Ag/C contact material is 0.026g higher than Cu Punch contact material.
The highest temperature
rise of Ag/C step contact material belongs to chemical element N III at the
wavelength 500 nm. The maximum temperature rise for the Cu punch contact material is the
chemical elements NII at the wavelength 428 nm. The maximum temperature rise for the Cu punch
contact material is higher than the Ag/C step contact material. Both Ag/C step contact
material and Cu Punch contact material have the same minimum temperature
rise and the same chemical element Cu II, at the wavelength 776 nm. The average temperature rise for the Ag/C contact material is lower than the
Cu Punch contact material about 0.25x10-33 K.
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